Updates to Bid Opportunities

If your firm has already submitted the intent to bid notification for any of the listed bid releases, no action is required on your part. If your firm is interested in any of the packages listed herein, please return the intent to bid notification form and NDA per directions included in the invitation.

Multiple Invitations to Bid for Foxconn’s Industrial Construction Work Phase 1, Area 1 of Wisconn Valley Science and Technology Park are available and have been revised as follows.

Bid Release 5a – Fabrication Facility – Building Enclosure

Revised to confirm Pre-Bid Conference and Matchmaking Session meeting date

Bid Release 5b – Fabrication Facility

Civil and Landscaping has been combined with Bid Release 5c – Northeast Master Plan Civil Work.

Bid Release 5b/5c – Fabrication Facility and Northeast Masterplan – Civil and Landscaping

Bid Packages 06C Security Buildings and 10F Signage Work have been added
Pre-Bid Conference and Matchmaking Session on June 26th has been cancelled
Pre-Bid Conference and Matchmaking Session for 5b/5c will occur on July 17th

Bid Release 5e – Turnkey Systems
Updated document release date
Updated to include Pre-Bid Conference and Matchmaking Session date and location.
Bid Release title updated to clarify that Turnkey packages are systems only

Click here to find the invitations to bid.

Additionally, Exyte is seeking design vendors, manufacturers, and distributors desiring to provide product information to the Design Firm for Foxconn’s Fabrication Facility and associated support facilities in Area 1 of the Wisconn Valley Science & Technology Park. 

Products might include paint materials, plumbing, wiring, and associated clean room materials. Once product information is submitted, the material will be routed to the appropriate design discipline lead.

More information is available here under the Design Registration Website tab.